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SOLDERINGThe soldering tests are conducted to determine if materials can withstand soldering effects, such as resistance to soldering heat, as well as the solderability of components during the manufacturing process. RESISTANCE TO SOLDERING HEATThe test is performed for the purpose of determining whether component parts can withstand the effects of the heat to which they will be subjected during the soldering of their terminations. The heat can be either conducted heat through the termination into the component part, or radiant heat emanating from the solder dip or soldering iron when in close proximity to the body of the component part, or both. The heat of soldering can affect the electrical characteristics and cause mechanical damage as well to the part: Electrical characteristics of resistive elements, semiconductor devices, soldered connections, and insulation materials are affected in varying degrees by heat. Mechanical damage, such as loosening of terminations of windings, softening of insulation, opening of solder seals, and weakening of mechanical joints, can occur. Resistance to soldering heat testing is specified in the following: MIL-T-27, MIL-STD-202, MIL-STD-750, MIL-S-3928, MIL-S-8805, MIL-C-11015, MIL-F-15733, MIL-F-18327
SOLDERABILITY Solderability testing is specified in the following: MIL-PRF-27, MIL-T-27, MIL-STD-202, MIL-STD-454, MIL-STD-750, MIL-STD-3885, MIL-S-3928, MIL-S-15743, MIL-S-10399, MIL-C-11015, MIL-I-11683, MIL-R-13312, MIL-F-13926, MIL-C-14550, MIL-W-16878, MIL-T-17301, MIL-F-18327, MIL-R-18546, MIL-M-19097, MIL-H-19760, MIL-N-19900, MIL-S-20708, MIL-T-21200, MIL-S-22432, MIL-L-23886, UL-471, UL-42
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